The Fiber Laser Advantage to Chip and Wafer Marking

Marking chips and wafers is a requirement for manufacturers within the semiconductor, flat panel display and solar panel industries. Fiber laser systems can apply computer-generated images such as bar codes, serial numbers, logos, and UID marks to a wide variety of metallic and nonmetallic materials. In the chip and wafer manufacturing process, such marks are the key to traceability and improving production processes. Direct fiber laser marking is becoming widely accepted as the best solution.

As an advancement to traditional ink marking, the nd:YAG laser was the earliest laser to be used for wafer marking. The nd:YAG laser is still the most common in the industry; however, manufacturers are now, more than ever, focused on improving processes to reduce costs and increase throughput, thereby increasing profitability. The lower cost of ownership (COO) and higher throughput of fiber laser marking systems compared to the YAG laser and traditional ink marking makes fiber laser systems very appealing.

Lower Costs, Higher Throughput
Manufacturing and material processing equipment can be very expensive; especially when your process contains two or more different applications. A unique benefit of fiber laser systems is that one laser can operate different processes with the use of an optical switch. For example, a manufacturer can operate cutting, marking and welding machines all off of the same fiber laser. This is especially beneficial to companies who are experiencing growth or looking to move into different processing markets.

As production increases or new applications need to be implemented a manufacturer can also upgrade their laser wattage easily and affordably. Since the laser itself is the most expensive component of a system, manufacturers can save a considerable amount of money while expanding their operation in a more exponential manner. Additionally, the average diode life for Co2 and nd:YAG lasers is approximately 10,000 to 20,000 hours. Fiber lasers have an astonishing 50,000 to 100,000 hour diode life. A longer diode life, means less maintenance and less down time to change out the diode allowing your production to continue.

Compared to Co2 and nd:YAG laser systems, fiber laser systems do not require the use of consumables in their operation and are approximately 20 times more energy efficient. Both of these factors not only help manufacturers become more eco-friendly but are also key to reducing operating costs.

Production speed and throughput is a major concern for most manufacturers. The combination of speed, performance and versatility of fiber laser systems cannot be matched by any other marking technique. Fiber lasers offer high throughput due to the fiber-to-fiber architecture presenting a robust, monolithic design with no optics to align or maintain, no mechanics to stabilize, and high power densities are able to process even the most demanding applications. This allows manufacturers to increase the rate they process materials while not having to compromise any quality.

Semiconductor Industry Applications
Portable digital components, cell phones, PDAs, and digital cameras become smaller and more lightweight but continue to increase in functionality. The Direct Chip Attach (DCA) or flip chip produces a need for wafer identification and tracking. Laser marking a wafer before it has been diced and processed enables manufacturers to trace defective parts. Due to the ever shrinking size of chips, the ability of a fiber laser to produce a small spot size weighs in heavily. Utilizing laser marking, as opposed to ink marking, is the best solution because it provides a mark that is permanent, readable, and of a enough high quality to meet even the most stringent requirements.

Flat Panel Display Industry Applications
Traditional methods to mark glass panels with tracking codes such as mechanical etching can crack the surface of the glass thereby compromising the overall strength and quality of the glass. These cracks can potentially lead to panel issues in the future. Additionally, the marks are not always clear enough to be scanned or easily read. Although laser marking technology has been around since the 1970s, it has been slow to replace traditional methods. But, the combination of speed, permanence, and reliability, is making manufacturers stand up and take notice when high throughput, time savings and lower costs are clearly the focus for flat panel display manufacturers.

Solar Industry Applications
Typically, consumers require 20 to 25 year warranties on solar panels. Therefore, wafer marking in solar cell manufacturing for traceability is a must. Traditional methods to mark panels with tracking codes such as mechanical etching or engraving using a Co2 laser can crack or chip the surface of the glass thereby compromising the overall strength and quality of the glass. Due the harsh environments the panels must endure, these imperfections can potentially lead to panel issues in the future affecting panel longevity.

Overall, fiber laser marking has proven to be the best solution to chip and wafer manufacturers, because it produces a permanent, readable, and high quality mark fulfilling manufacturers marking's most stringent requirements. And finally, the lower cost of ownership (COO) and higher throughput of fiber laser marking systems can’t be ignored in these tough economic times.

Fonon DSS, the cutting edge developer of state-of-the-art, laser scribing, dicing, marking, coating removal, direct patterning, and photo mask repair solutions for the Flat Panel Display (FPD), Semiconductor, Photovoltaic and Electronics industries throughout the world. For more information about Fonon DSS’ systems, please visit http://www.fonondss.com/ or call 407-829-2613.

Media Contact:
Maureen McHale
mmchale@laserphotonics.com
407-829-2613 x317

Semiconductor Online Features Fonon DSS!

Semiconductor Online featured Fonon Display and Semiconductor Systems new invention -Laser Direct Writing! To read the complete article, click on the logo below:

Fonon DSS Invents Laser Direct Writing

Fonon DSS (Display & Semiconductor Systems), the innovative developer of state-of-the-art, laser scribing, dicing, marking, coating removal, direct patterning, and photo mask repair solutions for the Flat Panel Display (FPD), Semiconductor, Photovoltaic and Electronics industries throughout the world announced the invention of Laser Direct Writing for tracking glass panels.

Traditional methods to mark panels with tracking codes such as mechanical etching or engraving using a Co2 Laser can crack the surface of the glass thereby compromising the overall strength and quality of the glass. These cracks can potentially lead to panel failure issues in the future. Additionally, the marks were not always clear enough to be scanned or read.

Laser Direct Writing is a non-destructive, patent pending laser marking technology which marks glass without damaging the surface while producing a readable image. This process does not require tapes or sprays to make the mark thereby eliminating any cleaning and post processing required with other methods.

“Panel manufacturers have been looking for a better way to mark panels with bar codes and UID marks,” said Maureen McHale, the Corporate Marketing and Public Relations Manager for FononDSS. “Laser Direct Writing creates a black, semi-transparent or gold marking on glass and is ideal for tracking the life of the panel. This process does not damage the glass and ensures readability of the mark.”

Fonon DSS, the cutting edge developer of state-of-the-art, laser scribing, dicing, marking, coating removal, direct patterning, and photo mask repair solutions for the Flat Panel Display (FPD), Semiconductor, Photovoltaic and Electronics industries throughout the world. For more information about Fonon DSS’ systems, please visit http://www.fonondss.com/ or call 407-829-2613.

Media Contact:

Maureen McHale
mmchale@laserphotonics.com

407-829-2613 x317

IC Chip Failure Analysis System - the FiberTower DFAS

Fonon DSS (Display & Semiconductor Systems), the cutting edge developer of state-of-the-art, laser scribing, dicing, marking, coating removal, direct patterning, and photo mask repair solutions to the Flat Panel Display (FPD), Semiconductor, Photovoltaic and Electronics industries throughout the world announced today the release of the improved FiberTower™ DFAS IC chip package failure analysis system.

The FiberTower™ DFAS uses laser technology to allow an operator to remove individual layers of the mold compound all the way through to the substrate. The DFAS operator can chose to remove the entire compound, individual layers, or sections of the mold compound ranging from the entire sample to just one wire due to the precision of the laser spot positioning. The FiberTower™ DFAS can import images from a variety of testing processes such as SAM, X-Ray, and SEM to show the operator exactly the area of concern within the sample.

Most failure analysis labs use time consuming chemical and mechanical etching processes on a routine basis to dissect chips to see why they failed. Unlike the uncontrollable, wet, chemical etch process, the DFAS IC chip decapitation process is 100% controllable by the operator through a Graphic User Interface (GUI). Utilizing the laser equipped DFAS, the operator can select a specific area to examine instead of dissecting the whole chip as chemical and mechanical etchers must do.

Traditionally, diamond saws were used for processes commonly used in failure analysis. This process is very slow requiring a significant amount of time for additional polishing due to the large standoff required from the cut, and still does not guarantee that the sample will not be damaged. The DFAS utilizes a Fonon’s laser wafer ablation process to provide an extremely accurate dissection without damaging the sample.

The FiberTower™ DFAS also offers a laser spectrometry option to provide a detailed report of all the materials as they are being processed. This feature allows the operator to find inconsistencies within the compound, flow settlement, and contaminants, and provides detail report of the exact characteristics of the mold compound. Improvements to the FiberTower™ DFAS include the use of scan servos with position feedback for higher accuracy and scan see through capabilities for on time inspection.

Eliminating the majority of cost, sample damage, as well as long term health hazards associated with the use of chemicals, the DFAS performs chip failure analysis with unmatched safety, savings, accuracy and speed.

About Fonon DSS: A division of Fonon Technology International, the world renowned inventor and manufacturer of Zero Width Laser Cutting Technology™, Fonon DSS focuses on the semiconductor and flat panel display industries utilizing the patented Zero Width Laser Cutting Technology™ (ZWLCT™) to create products with the highest level of precision. Fonon DSS provides state-of-the-art laser scribing, laser dicing and fiber laser marking solutions to customers in the Flat Panel Display (FPD), Semiconductor and Electronics industries throughout the world. For more information, visit http://www.fonondss.com/ or call 407-829-2613.

Zero Width Laser Cutting Technology™ (ZWLCT™)

Fonon Technology International has developed a completely new industrial method known to the world as Zero Width Laser Cutting Technology™ (ZWLCT™). The ZWLCT™ technique uses a laser controlled Power Density profile on the material surface to generate the subsurface forces greater than intermolecular connections. Our patented Zero Width Laser Cutting Technology™ (ZWLCT™) has the highest level of precision known to man. This technology has dramatically improved the substrate separation process, specifically for latest generations (Gen 6, 7, and 8) glass panels for Flat Panel Display (FPD) manufacturing.

The methodology utilizes a non-contact laser induced internal stress to produce a controlled separation. Since the technique is non-contact, the surface degradation associated with mechanical scribe and break is eliminated. Yield loss as a result of particulate damage is also greatly reduced. Cutting substrates in clean room conditions becomes feasible with ZWLCT™ leading to the ability to introduce a production line concept into clean room substrate manufacturing. This has not been possible before because of debris generated during cutting and edge grinding which will not be generated during ZWLCT™ processing. In addition, cleaning facilities can also be substantially reduced. These factors offer a cost effective solution to manufacturing space and efficiency.

Our latest mathematical modeling and empirical data gathering resulted in the development of an improved method and the requisite industrial machinery to enable us to introduce these improvements into the FPD industry. With this new method we can create internal tensile forces so great that we can achieve total separation of display type glass WITHOUT COOLING. Under these conditions the MicroCrack™ would propagate in the glass body at a depth of more than 0.7 mm (for bare glass). This process is called Full Body Separation.

The ZWLCT™ method incorporates cooling of the glass surface following controlled heating, with the correct power density profile, this creates the intermolecular separation of the glass substrate to a certain depth. Depth ( t ) has an inverse relation to the speed ( v ) of cutting, assuming that power ( P ) is constant. This means that the slower the speed the deeper the MicroCrack™ that is formed. Both mathematical models and empirical data support these conclusions and field experience has verified these findings.

Zero Width Laser Cutting Technology™ is the only technology available in the world with a NON DIMENSIONAL cutting line. The waste material by the cutting process is totally eliminated.

Glass Wafer Dicing Technology

As a result of exposure in camera windows and IR filter devices Fonon developed a precision separation of glass panels into individual components with the Zero Width Laser Dicing Technology®.

The ZWLDT® splits materials at the molecular level at tremendous speed with no material loss. This results in the highest edge quality and the fastest dicing speed.

Integrated scribe and break equipment is available for 100 x 100 mm, 200 x 200 and 300 mm in diameter glass substrates mounted on a standard 300 mm wafer hoops.

Quick Release tape made it possible to remove individual substrates from the dicing tape without the edge damage with Pick and Place equipment.

Laser dicing system showing below is a special machine designed for precise dicing of glass wafers.

The Glass Wafer Dicing Process:

• Mount low-tack and quick-release tape on the metal tape frame
• Laminate the substrate on the tape
• Dice the substrate into specified-dimension dies with advanced Zero Width Laser Dicing Technology®
• Apply a cover film
• Flip upside down
• Break with a metal bar
• Expand on stretcher
• Remove individual substrates from dicing tape without edge damage with Pick Place equipment

Applications:

• Bio ID devices
• Cell Phone Cameras and Display Panels
• TFT & LCD Cells
• CCD & IR camera windows
• IR cut off filter

Advantages:

• Higher speeds
• Higher throughput
• High precision and accuracy
• No material loss
• Shortens process and can be brought into clean room
• Edges have a high resistance to breakage

Silicon Wafer Dicing Technology

Wafers have the highest value at the dicing stage and the primary focus of a ZWLDT® is to increase the number of dies, yield per wafer, and to maximize throughput while minimizing the HAZ specifically for “power hungry” RF micro devices and low-K wafer substrates.

Fonon DSS System is applicable for dicing of assorted semiconductor materials such as silicon (Si), gallium arsenide (GaAs), germanium (Ge), indium phosphide (InP), silicon carbide (SiC), gallium nitride (GaN), gallium phosphide (GaP), other compound materials, as well as low-k and multi-layer composite materials.

BLACKSTAR™ series of a Wafer Dicing Systems utilizing a basic Zero Width Laser Dicing Technology® (ZWLDT®) invented and patented by Fonon Technology modified to accommodate the requirements of a silicon wafer singulation process without affecting the existent dicing method, processes and procedures.

The possibility of a cut with zero or 20 micron narrow width (application specific) allows wafer layout designers to reduce the width of the spacing between adjacent die on a wafer. The spacing is normally reserved to allow for the width of the saw used to cut the wafer. A reduction of the spacing width will result in an increase of the real estate available for die, which will result in a significant reduction of the cost per die.

The elimination of particles, debris and cutting fluids converts wafer dicing and separation into a “clean” operation. In certain areas of technology, i.e. MEMS, this attribute can almost be considered an enabler, since it will be possible to cut these devices without generating particles, which can damage these micro-mechanisms.

In addition, the elimination of cleaning steps and processing of cutting fluids introduces additional cost savings in the overall component fabrication process.

The elimination of wear items and consumables such as saw blades and scribes and the increased reliability associated with non-contact cutting versus a mechanical process, greatly decreases the cost of ownership of the equipment for the end-user.

Fonon’s Technology enables high-yield dicing and scribing of new materials, complicated layer stacks, and thin wafers including wafers with low-k dielectric and wafers with brittle material layers such as glass or silicon.

Significant Advantages of FTI's Dicing and Separation Technology:

• Dicing thin silicon with high mechanical integrity and no chips.
• Higher yield for thin wafers.
• No Micro-Cracks, fragmentation or chipping even for silicon below 100µm thick.
• Dicing wafers with thick polymer layers such as wafer scale packages and alpha barriers.
  No or minimal material loss means more parts per wafer (210 instead of 120 with mechanical saw).
• High precision allows for smaller street width. Minimized Heat Affected Zone (HAZ).
• BlackStar™ is an alternative to mechanical saws too damaging and costly for cutting of thin silicon, low-K, and complex material wafers.