TFT Film Cutting

Fonon Technology International, Inc., the world-renowned inventor and manufacturer of equipment based on ZWLCT® (Zero Width Laser Cutting Technology®) offers the latest innovation in laser scribing for the FPD (Flat Panel Display) Industry, the Fantom™ product line. Offering a stand-alone system for scribing TFT LCD panels, based on a C3 Laser™ Integrated Glass Scribing Laser Module, the Fantom™ series of laser scribing systems are cable of scribing glass panels ranging in size from Generation 3 to the large format Generation 8.

Watch the TFT Film Cutting Video NOW!
http://www.fonondss.com/video_tft_film_cutting.html

Fonon DSS' Update on TFT LCDs

As of 2008, all color LCD TVs and monitors use thin-film transistor liquid crystal displays (TFT LCDs). Coincidently, the best known application of thin-film transistors is in TFT LCDs. In this process, transistors are embedded within the panel itself, reducing crosstalk between pixels and improving image stability. The most beneficial aspect of TFT technology is a separate transistor for each pixel on the display. As each transistor is small, the amount of charges essential for controlling it also small. This allows for very fast re-drawing of the display. Prior to TFT, passive matrix LCD displays could not keep up with fast moving images. A mouse dragged across the screen, for example, from point A to point B, would disappear between the two points. A TFT monitor can track the mouse, resulting in a display that can be used for video, gaming and all forms of multimedia.

The Future of TFT LCDs
As the world still struggles to determine if we’re in a recession, depression or none of the above, some industries are showing signs that the worst of whatever ails us, although may not be completely over, is starting to show signs of improvement. The flat panel display industry, for one, seems to have reached the bottom of the cycle back in February 2009 and now the latest survey results are showing some recovery.

According to the March 2009 DisplaySearch report, shipments of large-area TFT LCD panels reached 37.9 million units, showing strong month over month growth of 29%. Additionally, large-area TFT LCD revenues reached $3.9 billion, up 31% month over month and all three major applications—notebook PC, monitor and TV—showed over 20% month over month growth, and total shipments were the highest in six months.

“As the FPD industry starts to rebound, businesses should be looking at using technology to improve their manufacturing operations during these tough economic times so that when the market does fully recover – they’re already ahead of the game.” This is according to Maureen McHale the Corporate Marketing and Public Relations Manager for Fonon Display and Semiconductor Systems (Fonon DSS). “This is a time for innovative thinking and for manufacturers to take advantage of the current economic situation by improving processes, updating equipment and implementing cost saving technology," she explained.

Laser Equipment for the FPD Industry
Fonon DSS has developed laser equipment for the flat panel display (FPD) industry which is used in helping to create very thin display screens for portable computers, T.V. screens, radio faces, and most LCD technology. Flat panel display technology has become increasing popular over other existing technologies because the display is thinner, lightweight and more power efficient. Manufacturing this high tech product requires equally high tech equipment like fiber laser systems which are not only able to produce high quality results, they can lower manufacturing costs and increase throughput.

Fonon DSS’ turnkey equipment is designed and built utilizing cutting-edge technology and patented methods including Zero Width Laser Cutting Technology (ZWLCT®). This new industrial method uses a laser controlled power density profile on the material surface to generate the subsurface forces greater than intermolecular connections. The methodology utilizes a non-contact laser induced internal stress to produce a controlled separation. Since the technique is non-contact, the surface degradation associated with mechanical scribe and break is eliminated, thus removing the need for additional cleaning of the glass. Yield loss as a result of particulate damage is also greatly reduced. This technique has the highest level of precision known to man and it has dramatically improved the substrate separation process, specifically for latest generations (Gen 6, 7, and 8) glass panels for Flat Panel Display (FPD) manufacturing.

In order to utilize the patented ZWLCT® for laser scribing glass for the FPD industry, Fonon DSS has incorporated this technology into the latest innovation, the Fantom™ product line. These stand-alone systems have been built for scribing TFT LCD panels, utilizing a C3 Laser™ Integrated Glass Scribing Laser Module. Fonon DSS' Fantom™ laser scribers are designed to increase efficiency providing higher throughput rates and continually proving to be the more cost effective solution.

Discover the Fantom™ Advantages:

The Fantom™ product line offers many advantages over traditional, more costly methods as outlined here:

1) In comparison to the older method of glass cutting, the cost of ZWLCT® technology continues to decrease, while mechanical scribing systems increase. As panel sizes increase the cost of mechanical equipment grows exponentially with each increase in panel size, while laser equipment costs only increase linearly. This change in market ROI makes Fonon DSS' laser scribers and ZWLCT® methods the clear choice when comparing cost factors.

2) Fonon’s patented glass scribing technology surpasses the older mechanical technology used to cut glass and other brittle materials for the electronic and semiconductor industries. Conventional technology creates vent cracks by stressing the substrate, which in turn creates surface damage and lateral cracks, resulting in particulate generation, and yield loss. It is this loss, plus the purchase cost for mechanical scribing and breaking systems, that has become the significant contributor to the retail cost of modern flat panel displays.

3) The Fantom™ scribing systems utilize ZWLCT® which allows scribing applications to be processed with tremendous speed, no material loss, and no chips or other debris associated with conventional scribe and break techniques thereby eliminating the cleaning and grinding line.
Enhancements are continually being made to ZWLCT® methods and the Fantom™ line - growing and changing with the industry, allowing manufacturers to reduce costs and increase production. For more information about Fonon DSS’ Fantom™ laser scribing systems and more laser equipment, please visit http://www.fonondss.com/ or call 407-829-2613.

Fonon DSS, the cutting edge developer of state-of-the-art, laser scribing, dicing, marking, coating removal, direct patterning, and photo mask repair solutions for the Flat Panel Display (FPD), Semiconductor, Photovoltaic and Electronics industries throughout the world.

Media Contact:
Maureen McHale
mmchale@fonondss.com
407-829-2613 x317

The Fiber Laser Advantage to Chip and Wafer Marking

Marking chips and wafers is a requirement for manufacturers within the semiconductor, flat panel display and solar panel industries. Fiber laser systems can apply computer-generated images such as bar codes, serial numbers, logos, and UID marks to a wide variety of metallic and nonmetallic materials. In the chip and wafer manufacturing process, such marks are the key to traceability and improving production processes. Direct fiber laser marking is becoming widely accepted as the best solution.

As an advancement to traditional ink marking, the nd:YAG laser was the earliest laser to be used for wafer marking. The nd:YAG laser is still the most common in the industry; however, manufacturers are now, more than ever, focused on improving processes to reduce costs and increase throughput, thereby increasing profitability. The lower cost of ownership (COO) and higher throughput of fiber laser marking systems compared to the YAG laser and traditional ink marking makes fiber laser systems very appealing.

Lower Costs, Higher Throughput
Manufacturing and material processing equipment can be very expensive; especially when your process contains two or more different applications. A unique benefit of fiber laser systems is that one laser can operate different processes with the use of an optical switch. For example, a manufacturer can operate cutting, marking and welding machines all off of the same fiber laser. This is especially beneficial to companies who are experiencing growth or looking to move into different processing markets.

As production increases or new applications need to be implemented a manufacturer can also upgrade their laser wattage easily and affordably. Since the laser itself is the most expensive component of a system, manufacturers can save a considerable amount of money while expanding their operation in a more exponential manner. Additionally, the average diode life for Co2 and nd:YAG lasers is approximately 10,000 to 20,000 hours. Fiber lasers have an astonishing 50,000 to 100,000 hour diode life. A longer diode life, means less maintenance and less down time to change out the diode allowing your production to continue.

Compared to Co2 and nd:YAG laser systems, fiber laser systems do not require the use of consumables in their operation and are approximately 20 times more energy efficient. Both of these factors not only help manufacturers become more eco-friendly but are also key to reducing operating costs.

Production speed and throughput is a major concern for most manufacturers. The combination of speed, performance and versatility of fiber laser systems cannot be matched by any other marking technique. Fiber lasers offer high throughput due to the fiber-to-fiber architecture presenting a robust, monolithic design with no optics to align or maintain, no mechanics to stabilize, and high power densities are able to process even the most demanding applications. This allows manufacturers to increase the rate they process materials while not having to compromise any quality.

Semiconductor Industry Applications
Portable digital components, cell phones, PDAs, and digital cameras become smaller and more lightweight but continue to increase in functionality. The Direct Chip Attach (DCA) or flip chip produces a need for wafer identification and tracking. Laser marking a wafer before it has been diced and processed enables manufacturers to trace defective parts. Due to the ever shrinking size of chips, the ability of a fiber laser to produce a small spot size weighs in heavily. Utilizing laser marking, as opposed to ink marking, is the best solution because it provides a mark that is permanent, readable, and of a enough high quality to meet even the most stringent requirements.

Flat Panel Display Industry Applications
Traditional methods to mark glass panels with tracking codes such as mechanical etching can crack the surface of the glass thereby compromising the overall strength and quality of the glass. These cracks can potentially lead to panel issues in the future. Additionally, the marks are not always clear enough to be scanned or easily read. Although laser marking technology has been around since the 1970s, it has been slow to replace traditional methods. But, the combination of speed, permanence, and reliability, is making manufacturers stand up and take notice when high throughput, time savings and lower costs are clearly the focus for flat panel display manufacturers.

Solar Industry Applications
Typically, consumers require 20 to 25 year warranties on solar panels. Therefore, wafer marking in solar cell manufacturing for traceability is a must. Traditional methods to mark panels with tracking codes such as mechanical etching or engraving using a Co2 laser can crack or chip the surface of the glass thereby compromising the overall strength and quality of the glass. Due the harsh environments the panels must endure, these imperfections can potentially lead to panel issues in the future affecting panel longevity.

Overall, fiber laser marking has proven to be the best solution to chip and wafer manufacturers, because it produces a permanent, readable, and high quality mark fulfilling manufacturers marking's most stringent requirements. And finally, the lower cost of ownership (COO) and higher throughput of fiber laser marking systems can’t be ignored in these tough economic times.

Fonon DSS, the cutting edge developer of state-of-the-art, laser scribing, dicing, marking, coating removal, direct patterning, and photo mask repair solutions for the Flat Panel Display (FPD), Semiconductor, Photovoltaic and Electronics industries throughout the world. For more information about Fonon DSS’ systems, please visit http://www.fonondss.com/ or call 407-829-2613.

Media Contact:
Maureen McHale
mmchale@laserphotonics.com
407-829-2613 x317