IC Chip Failure Analysis System - the FiberTower DFAS

Fonon DSS (Display & Semiconductor Systems), the cutting edge developer of state-of-the-art, laser scribing, dicing, marking, coating removal, direct patterning, and photo mask repair solutions to the Flat Panel Display (FPD), Semiconductor, Photovoltaic and Electronics industries throughout the world announced today the release of the improved FiberTower™ DFAS IC chip package failure analysis system.

The FiberTower™ DFAS uses laser technology to allow an operator to remove individual layers of the mold compound all the way through to the substrate. The DFAS operator can chose to remove the entire compound, individual layers, or sections of the mold compound ranging from the entire sample to just one wire due to the precision of the laser spot positioning. The FiberTower™ DFAS can import images from a variety of testing processes such as SAM, X-Ray, and SEM to show the operator exactly the area of concern within the sample.

Most failure analysis labs use time consuming chemical and mechanical etching processes on a routine basis to dissect chips to see why they failed. Unlike the uncontrollable, wet, chemical etch process, the DFAS IC chip decapitation process is 100% controllable by the operator through a Graphic User Interface (GUI). Utilizing the laser equipped DFAS, the operator can select a specific area to examine instead of dissecting the whole chip as chemical and mechanical etchers must do.

Traditionally, diamond saws were used for processes commonly used in failure analysis. This process is very slow requiring a significant amount of time for additional polishing due to the large standoff required from the cut, and still does not guarantee that the sample will not be damaged. The DFAS utilizes a Fonon’s laser wafer ablation process to provide an extremely accurate dissection without damaging the sample.

The FiberTower™ DFAS also offers a laser spectrometry option to provide a detailed report of all the materials as they are being processed. This feature allows the operator to find inconsistencies within the compound, flow settlement, and contaminants, and provides detail report of the exact characteristics of the mold compound. Improvements to the FiberTower™ DFAS include the use of scan servos with position feedback for higher accuracy and scan see through capabilities for on time inspection.

Eliminating the majority of cost, sample damage, as well as long term health hazards associated with the use of chemicals, the DFAS performs chip failure analysis with unmatched safety, savings, accuracy and speed.

About Fonon DSS: A division of Fonon Technology International, the world renowned inventor and manufacturer of Zero Width Laser Cutting Technology™, Fonon DSS focuses on the semiconductor and flat panel display industries utilizing the patented Zero Width Laser Cutting Technology™ (ZWLCT™) to create products with the highest level of precision. Fonon DSS provides state-of-the-art laser scribing, laser dicing and fiber laser marking solutions to customers in the Flat Panel Display (FPD), Semiconductor and Electronics industries throughout the world. For more information, visit http://www.fonondss.com/ or call 407-829-2613.

Zero Width Laser Cutting Technology™ (ZWLCT™)

Fonon Technology International has developed a completely new industrial method known to the world as Zero Width Laser Cutting Technology™ (ZWLCT™). The ZWLCT™ technique uses a laser controlled Power Density profile on the material surface to generate the subsurface forces greater than intermolecular connections. Our patented Zero Width Laser Cutting Technology™ (ZWLCT™) has the highest level of precision known to man. This technology has dramatically improved the substrate separation process, specifically for latest generations (Gen 6, 7, and 8) glass panels for Flat Panel Display (FPD) manufacturing.

The methodology utilizes a non-contact laser induced internal stress to produce a controlled separation. Since the technique is non-contact, the surface degradation associated with mechanical scribe and break is eliminated. Yield loss as a result of particulate damage is also greatly reduced. Cutting substrates in clean room conditions becomes feasible with ZWLCT™ leading to the ability to introduce a production line concept into clean room substrate manufacturing. This has not been possible before because of debris generated during cutting and edge grinding which will not be generated during ZWLCT™ processing. In addition, cleaning facilities can also be substantially reduced. These factors offer a cost effective solution to manufacturing space and efficiency.

Our latest mathematical modeling and empirical data gathering resulted in the development of an improved method and the requisite industrial machinery to enable us to introduce these improvements into the FPD industry. With this new method we can create internal tensile forces so great that we can achieve total separation of display type glass WITHOUT COOLING. Under these conditions the MicroCrack™ would propagate in the glass body at a depth of more than 0.7 mm (for bare glass). This process is called Full Body Separation.

The ZWLCT™ method incorporates cooling of the glass surface following controlled heating, with the correct power density profile, this creates the intermolecular separation of the glass substrate to a certain depth. Depth ( t ) has an inverse relation to the speed ( v ) of cutting, assuming that power ( P ) is constant. This means that the slower the speed the deeper the MicroCrack™ that is formed. Both mathematical models and empirical data support these conclusions and field experience has verified these findings.

Zero Width Laser Cutting Technology™ is the only technology available in the world with a NON DIMENSIONAL cutting line. The waste material by the cutting process is totally eliminated.

Glass Wafer Dicing Technology

As a result of exposure in camera windows and IR filter devices Fonon developed a precision separation of glass panels into individual components with the Zero Width Laser Dicing Technology®.

The ZWLDT® splits materials at the molecular level at tremendous speed with no material loss. This results in the highest edge quality and the fastest dicing speed.

Integrated scribe and break equipment is available for 100 x 100 mm, 200 x 200 and 300 mm in diameter glass substrates mounted on a standard 300 mm wafer hoops.

Quick Release tape made it possible to remove individual substrates from the dicing tape without the edge damage with Pick and Place equipment.

Laser dicing system showing below is a special machine designed for precise dicing of glass wafers.

The Glass Wafer Dicing Process:

• Mount low-tack and quick-release tape on the metal tape frame
• Laminate the substrate on the tape
• Dice the substrate into specified-dimension dies with advanced Zero Width Laser Dicing Technology®
• Apply a cover film
• Flip upside down
• Break with a metal bar
• Expand on stretcher
• Remove individual substrates from dicing tape without edge damage with Pick Place equipment

Applications:

• Bio ID devices
• Cell Phone Cameras and Display Panels
• TFT & LCD Cells
• CCD & IR camera windows
• IR cut off filter

Advantages:

• Higher speeds
• Higher throughput
• High precision and accuracy
• No material loss
• Shortens process and can be brought into clean room
• Edges have a high resistance to breakage

Silicon Wafer Dicing Technology

Wafers have the highest value at the dicing stage and the primary focus of a ZWLDT® is to increase the number of dies, yield per wafer, and to maximize throughput while minimizing the HAZ specifically for “power hungry” RF micro devices and low-K wafer substrates.

Fonon DSS System is applicable for dicing of assorted semiconductor materials such as silicon (Si), gallium arsenide (GaAs), germanium (Ge), indium phosphide (InP), silicon carbide (SiC), gallium nitride (GaN), gallium phosphide (GaP), other compound materials, as well as low-k and multi-layer composite materials.

BLACKSTAR™ series of a Wafer Dicing Systems utilizing a basic Zero Width Laser Dicing Technology® (ZWLDT®) invented and patented by Fonon Technology modified to accommodate the requirements of a silicon wafer singulation process without affecting the existent dicing method, processes and procedures.

The possibility of a cut with zero or 20 micron narrow width (application specific) allows wafer layout designers to reduce the width of the spacing between adjacent die on a wafer. The spacing is normally reserved to allow for the width of the saw used to cut the wafer. A reduction of the spacing width will result in an increase of the real estate available for die, which will result in a significant reduction of the cost per die.

The elimination of particles, debris and cutting fluids converts wafer dicing and separation into a “clean” operation. In certain areas of technology, i.e. MEMS, this attribute can almost be considered an enabler, since it will be possible to cut these devices without generating particles, which can damage these micro-mechanisms.

In addition, the elimination of cleaning steps and processing of cutting fluids introduces additional cost savings in the overall component fabrication process.

The elimination of wear items and consumables such as saw blades and scribes and the increased reliability associated with non-contact cutting versus a mechanical process, greatly decreases the cost of ownership of the equipment for the end-user.

Fonon’s Technology enables high-yield dicing and scribing of new materials, complicated layer stacks, and thin wafers including wafers with low-k dielectric and wafers with brittle material layers such as glass or silicon.

Significant Advantages of FTI's Dicing and Separation Technology:

• Dicing thin silicon with high mechanical integrity and no chips.
• Higher yield for thin wafers.
• No Micro-Cracks, fragmentation or chipping even for silicon below 100µm thick.
• Dicing wafers with thick polymer layers such as wafer scale packages and alpha barriers.
  No or minimal material loss means more parts per wafer (210 instead of 120 with mechanical saw).
• High precision allows for smaller street width. Minimized Heat Affected Zone (HAZ).
• BlackStar™ is an alternative to mechanical saws too damaging and costly for cutting of thin silicon, low-K, and complex material wafers.

Product Update: The Fantom G8™ - Cost Savings Uncovered

Fonon Display and Semiconductor Systems’ Fantom G8™ utilizes Zero Width Laser Cutting Technology™ (ZWLCT™) which allows scribing applications to be processed with tremendous speed, no material loss, and no chips or other debris associated with conventional scribe and break techniques. Additionally, ZWLCT™ maintains the integrity of the glass, making it three to five times mechanically stronger.

“The Fantom G8™ splits materials at the molecular level with tremendous speed, no material loss, and no chips or other debris associated with conventional scribe and break techniques, it is ideal for ultra thin and larger G8-G11 size panels”, said Demitri Nikitin, CEO of Fonon Display and Semiconductor Systems. “Plus, the cost savings on the Fantom G8™ are tremendous and our prices not only include installation, but startup, and training as well.”

Consider the Savings:

• The Fantom G8™ is a low cost solution for precision glass scribing priced the same as or less than precision mechanical scribers.
• The Fantom G8™will produce glass panels without any additional edge processing, eliminating the grinding and cleaning line.
• The Fantom G8™ features adjustable loading and unloading positions for in-line integration saving valuable processing time.
• The Fantom G8™ is “plug-n-play”. It’s easy to install, quick to start-up and its operators training requirement levels are reduced.
• The Fantom G8™ requires no laser service, no gas consumption, no optical alignments, and no optics cleaning.
• The Fantom G8™’s modular design utilizes standard components for easier service.
• The Fantom G8 can be easily integrated into an inline system.